Wafer Backend Process Engineer: Tape Expansion & UV Curing

RF360 SINGAPORE PTE. LTD. is seeking a proactive Process Engineer to support backend wafer level manufacturing operations. The role focuses on sustaining critical processes, troubleshooting equipment, and driving continuous improvement initiatives.

The ideal candidate will have a Bachelor's Degree in Mechanical or Manufacturing Engineering, with a minimum of 2 years of hands-on experience in semiconductor backend packaging processes. Strong knowledge of Wafer level Taping and project leadership skills are preferred.