Vacancy Description
Tätigkeitsbereich:Forschung & Entwicklung incl. DesignFachabteilung:Research & Development Hardware & System SolutionGesellschaft:Mercedes-Benz Digital Tech Ltd.Standort:Shanghai, Xingchi Tower, No. , Keqiao Road, Jinqiao, Pudong Startdatum:sofortVeröffentlichungsdatum:..6Stellennummer:MEREArbeitszeit:Vollzeit BewerbenAufgabenPa...
Objective:
Responsible for mechanical, thermal and integration development activities for Cockpit, ADAS and Centralized Computing hardware products.
Support product development from concept definition through vehicle integration and production release by driving mechanical design reviews, thermal solution development, packaging studies, harness integration and supplier technical evaluations.
Ensure products achieve targets for thermal performance, structural robustness, manufacturability, serviceability and vehicle integration compatibility across different carline projects.
Task Description1. Mechanical & Thermal Development
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