U

Technology Development Engineer (Advanced Packaging)

UNITED MICROELECTRONICS CORPORATION (Singapore Branch)

singapore, singapore, Singapore Full-time June 27, 2026
Apply Now

Vacancy Description

We are looking for a skilled OSAT & AdvancedPackaging Engineer to drive Advanced packaging with external OSAT partners. This role will focus on advanced packaging technologies, ensuring high-quality, cost-effective, and timely product delivery while collaborating with cross-functional team.

Job Responsibilities:

  • Work on 2.5D/3D packaging platform technologies.
  • Develop bump, underfill, molding and RDL processes.
  • Collaborate with internal R&D and OSAT partners to drive Heterogeneous Integration.
  • New advanced packaging process verification and qualification.
  • Customer engagement and new product verification

Capability

  • Knowledge of bumping, molding, dicing, bonding, RDL (RedistributionLayer), and interconnect technologies are plus.
  • Experienced in 2.5D and 3DIC process development are plus.
  • Skill on FMEA, control plan, DOE (design of experiment) and problemsolvin...

Ready to Apply?

अभी आवेदन करें

Submit your application for Technology Development Engineer (Advanced Packaging) at UNITED MICROELECTRONICS CORPORATION (Singapore Branch)

Apply for this Position