Technical Solutions Lead, Bonding Systems

Michael Page is hiring for a technical lead role in semiconductor bonding processes, aimed at supporting Ball Bonder and Wedge Bonder customers in Malaysia. The position requires expertise in both pre-sales and post-sales activities, focusing on customer satisfaction and successful product adoption.

The ideal candidate holds a degree in Mechanical or Electrical Engineering and has 5-10 years of experience in the semiconductor industry. Responsibilities include leading customer engagements, managing technical solutions, and collaborating with cross-functional teams to resolve challenges.