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Staff Process Engineer ( Dicing/ Grinding/ LLO/ Bonding)

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd

kulim, kedah, Malaysia Full-time July 06, 2026
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Vacancy Description

Staff Process Engineer (Dicing/Grinding/LLO/Bonding) – Kulim, Malaysia

Sense the power of light

ams OSRAM is a global leader in innovative light and sensor solutions. “Sense the power of light” – our success is based on our deep understanding of the potential of light. By adding intelligence to light, we enable our customers to drive transformative applications. Our around 20,000 employees worldwide focus on innovation alongside the societal megatrends of digitalization, smart living, energy efficiency, and sustainability. Whatever your role is, you are a part of a talented team that enjoys exploring and designing new technologies.

Your new responsibilities

  • To sustain and optimize dicing/ grinding/ LLO/ Bonding process & equipment for continuous improvement, countermeasure issue, ensuring tool maximum productivity, new product qualification & release.
  • Lead, develop and optimize dicing/ grinding / LLO/ Bonding process to ensure r...

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