Vacancy Description
The application window is expected to close on: 06/30/2026
Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received .
Meet the Team
As Hardware Test & Packaging Engineer, you will help develop and support Cisco's next generation component and packaging platform for Cisco's Silicon Photonics Integrated Circuits and chipsets. As a member of the platform team (engineering), you'll be responsible for improving and supporting high-volume, automated optical assembly and test processes.
Your Impact
Design, Develop and Support
Work as part of platform team that develops tools and components for high-volume manufacturing to support, debug and improve tools and processes
Analyze data from Cisco's automated packaging tools/processes to shape new projects targeting improvements in Cisco-designed high-volume manufacturing platforms
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