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SiC Wafer and Package Technology Development Engineer

Onsemi

Pocatello, Idaho, United States Full time June 12, 2026
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Vacancy Description

Technical and customer support for the qualification of SiC die sales and development

SiC wafer die sales is a main focus for onsemi and is critical to its future. This opportunity is for those who are technically focused and thrive on solving complex challenges and leading global teams to create future technology platforms and intellectual property for onsemi.

  • Work with fellow technologists, customers, business unit representatives, sales, reliability, and other teams on a global basis to develop and qualify the next generation of SiC technologies which meets the cost, performance, manufacturing, timeline and reliability goals
  • Lead and organize efficient development methodologies to address issues and lead technology development through cross functional teams
  • Understand detailed customer requirements and verify latest technologies meet or exceed all expectations
  • Document findings and process flows to create baseline for new technology platfo...

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    Vacancy Details

    Location Pocatello, Idaho
    Country United States
    Type Full time
    Category Engineers
    Posted June 12, 2026

    About Onsemi

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    Onsemi

    Pocatello, United States

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