Senior Scientist II (Advanced Packaging), IME

Research Scientists – Optical Interconnects for Next-Generation AI Clusters

We are recruitingResearch Scientiststo join an ambitious research programme developing thenext generation of ultra-high-bandwidth, ultra-energy-efficient optical interconnects for AI clusters.

As AI models continue to scale to trillions of parameters, future AI infrastructure will depend on new interconnect technologies that can move enormous volumes of data between compute and memory nodes with much lower energy consumption. This project focuses on enablingpetascale interconnectsthrough advanced2.5D/3D electronic-photonic integration, targetingoptical I/O beyond 100 Tb/s per compute node,up to 10 Tb/s/mm bandwidth density, and~1 pJ/bit energy efficiency.

This is a unique opportunity to work at the intersection of advanced packaging, silicon photonics, high-speed interfaces, thermal design, and AI hardware systems. Successful candidates will contribute ...