Vacancy Description
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a member of HIG HBM Package Product Engineering, you will be part of a high-performing team to drive Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI's Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization.
Key Responsibilities- ASM Yield and DPM Improvement:...
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Submit your application for Senior Product Engineer, Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) at micron semiconductor asia operations pte. ltd.
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