Senior Process Engineer – Silicon Photonics Wafer & Dicing

Lumilens Inc. is seeking an experienced process engineer to advance silicon photonic wafer backside grinding, thinning, and laser stealth dicing. You will develop die sorting methods for silicon photonic chips and collaborate with internal lines or OSAT partners.

The role emphasizes optimizing thinning thickness, cutting parameters, and material integrity while solving defects and improving yield. A strong background in materials science and microelectronics is expected.