Senior Package Health Test Engineer (HBM/AI Focus)

Micron Technology, Inc in Singapore is looking for a Package Health Test Engineer to contribute to the development and execution of package health monitoring and reliability testing. This role involves defining test coverage for wafer and die level processes and performing electrical characterization of advanced packages including HBM.

The ideal candidate will have a Bachelor's or Master's degree in Electrical Engineering, along with 2+ years of relevant experience in the semiconductor industry. Proficiency in AI/ML tools and scripting is highly valued.