Senior Equipment Engineer - Front-End ASM & Die Bond

ON Semiconductor Malaysia Sdn. Bhd. is seeking an experienced Senior Equipment Engineer to lead the front-end assembly equipment team.

You will supervise shift technicians, drive maintenance programs, and perform advanced troubleshooting across die bond, clip bond, reflow, and inspection lines. The ideal candidate brings hands-on ASM equipment expertise, a strong background in preventive and corrective maintenance, and a proven ability to improve OEE and process reliability.