Vacancy Description
This role plays a key technical leadership position, responsible for process robustness, equipment performance, yield improvement, and technology readiness from development through High Volume Manufacturing (HVM). Experience supporting BIM lines is a strong advantage.
What You Will Do
- Develop, characterize, optimize, and sustain molding processes and equipment for semiconductor backend assembly.
- Own molding process performance, yield, and equipment stability in production.
- Provide technical leadership and guidance on molding-related topics within cross-functional teams.
- Support New Product Introduction (NPI), process qualification, and smooth ramp-up into HVM.
- Drive continuous improvement initiatives to improve yield, quality, reliability, UPH, and cost efficiency.
- Identify molding process integration risks and define mitigation plans using structured engineering methods.
- Troubleshoot and resolve ...
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