Vacancy Description
Job Responsibilities
- Support developing and sustaining electroplating processes (Cu TSV/Damascene/ RDL/Pillar, UBM, micro-bump) in both R&D and small volume manufacturing environments.
- Support troubleshooting, root cause analysis for electroplating defects (e.g., voids, roughness, non-uniformity, adhesion issues).
- Design and perform DOEs to define process windows, characterize new requirements, and evaluate plating chemistries, technologies.
- Compile, analyse, and interpret test data to establish process specifications.
- Generate comprehensive technical reports for both internal teams and customers.
- Collaborate closely with senior engineers, process integrators, and cross-functional teams to align with technology roadmaps and process capability requirements.
- Bachelor's or higher degree in Materials Science, Chemical Engineering, Chemistry, or related fields.
- Knowled...
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