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Principal Product Engineer – High Power Module

Onsemi

Seremban, Negeri Sembilan, Malaysia Full time May 27, 2026
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Vacancy Description

Lead product engineering activities for Advanced Power Modules in the New Product Development (NPD) division. This role focuses on developing next-generation power modules using advanced embedded packaging technologies, such as chip embedding and interposer-based integration, to achieve high performance and reliability. You will ensure manufacturability, quality, and robustness through prototype builds, qualification runs, and validation processes, collaborating with global cross-functional teams to deliver automotive-grade solutions.

  • Prototype & Qualification Builds Plan and execute prototype and qualification runs for embedded power modules, ensuring compliance with NPD phase-gate requirements. Validate build integrity and maintain accurate documentation of process parameters and outcomes.
  • Advanced Embedded Packaging Apply expertise in chip embedding, interposer integration, and thermal/electrical optimization for module development. Perform process...
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