Principal Optoelectronic Packaging Engineer

Description

Position at Samtec, Inc Samtec is seeking an Advanced packaging and process architect to join our team at the Vista Design Center located in Vista, CA. The advanced packaging and process architect is a senior engineering leader responsible for designing, developing, and implementing next-generation optoelectronic packaging solutions. In this key role as a subject matter expert in the development of 2.5D/3D packaging solutions, you'll be instrumental in harnessing leading-edge technologies to create Samtec’s next generation optical module products. Essential Functions/ Responsibilities:

Research & Innovation: Research and analyze emerging material and process technologies within a roadmap connecting capabilities and products.

Architecture Development: Guide the physical architecture of advanced optoelectronic packages based on a broad knowledge of interconnect technologies (RDL, wire bonding, flip chip, solder, conductive adhesives, ma...