Vacancy Description
Responsibilities
- Module Ownership: Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit.
- Specification definition: Define structural specifications and process requirements for assigned modules.
- Strategic Direction: Set a clear direction and vision for the module and have a well‑defined continual improvement plan.
- Proactive Issue Resolution: Be proactive in identifying potential structural, electrical and reliability issues and address them early with process control. Solve problems with a model‑based approach.
- Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and manufacturability assessment and optimization.
- Material Innovation: Analyze materials physically, electrically, etc. and work with process groups etc. to select new mate...
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