Package Engineer (Permanent)

My client is looking for a Senior Packaging Process Engineer, to be an expert in leading microelectronics assembly and validation, specialising in advanced packaging technologies. The Senior Packaging Process Engineer will work on advanced AI infrastructure, co-packaged RF architectures, and photonic systems.
Develop advanced packaging assembly processes including 2.5D and 3D integration
Define interconnect schemes including flip chip, wafer-level packaging and hybrid bonding
Lead design-for-manufacturing activities with internal and external teams
Lead technical projects and contribute to proposals and funding activities
Provide technical guidance across multidisciplinary engineering teams
Strong experience in semiconductor packaging and microelectronics assembly
Hands-on experience with 2.5D/3D integration, hybrid bonding and SiP
Knowledge of TSV, RDL and wafer-level packaging processes
Experience leading R&D or packaging development projects
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