Vacancy Description
- We are seekinganexperienced engineering lead in device packaging, module mechanical assembly, PCBA and device test engineering leaderwith degree in Electrical Engineering, Photonics,Mechanical Engineer,or a related field.
What you'll do
- Lead Asia operation team working with OSATs, assembly houses, PCBA lines to support NPI and volume production.
- Working closely with HQ RnD and operation team to implement wafer level probe tests at OSATs to identify known good dies.
- Working with HQ team to support device packaging process improvement with Cp and Cpk increase.
- Work with HQ teams and our IIIV foundries to support wafer level process, bar level, and CoC process as well as CoC level test and qualification before and after burnin.
- Work with HQ teams and our assembly houses to support module assembly and PCBA for NPI and volume production.
- Work with reliability engineers to implement the tests needed f...
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