Home / Jobs / Microelectronic Bonder Level 2
L

Microelectronic Bonder Level 2

Lockheed Martin

United States, Massachusetts, United States Full-Time June 07, 2026
Apply Now

Vacancy Description

Job Description

You will be the Microelectronic Bonder for Lockheed Martin Missiles & Fire Control in Chelmsford, MA. Our team is responsible for fabricating and modifying hybrid microcircuits and sub‑assemblies that support critical defense systems.



What You Will Be Doing


As the Microelectronic Bonder, you will be responsible for executing high‑precision wire‑bonding and hybrid circuit fabrication tasks.


Your responsibilities will include, but are not limited to:



  • Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies.

  • Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques.

  • Requires the capability to troubleshoot defective hybrid...

    • Ready to Apply?

    अभी आवेदन करें

    Submit your application for Microelectronic Bonder Level 2 at Lockheed Martin

    Apply for this Position

    Vacancy Details

    Location United States, Massachusetts
    Country United States
    Type Full-Time
    Category Assemblers and Fabricators
    Posted June 07, 2026

    About Lockheed Martin

    L

    Lockheed Martin

    United States, United States

    Share This Vacancy