Lead Principal Engineer Package Technology Development

Your Role Key responsibilities in your new role: Drive
Micro Electro-Mechanical Systems
(MEMS) Package Technology Development
at Infineon, from
concept
to
high-volume ramp-up
. Act as the
lead engineer
and primary point of contact for direct communication with Infineon's key customers regarding
MEMS package technology
. Perform
process development activities
(including parameter scouting, optimization, verification, and process freeze) within development projects to achieve targets related to
timeline, quality, cost competitiveness, and manufacturability
. Define and drive technical specifications (BOM, package design, assembly process) for MEMS package projects involving major changes, risks, or new introductions. Lead a
global team
of process development engineers to successfully execute multiple
MEMS package NPI (New Product Introduction)
projects. Share your technical expertise and foster professional growth within your team....