Lead Bonding Process Engineer – Wafer-Level 3D Integration

A*STAR - Agency for Science, Technology and Research in Singapore is looking for a Bonding Process Control Engineer to optimize and sustain wafer-level bonding processes. The role focuses on process stability, yield improvement, and collaborating with cross-functional teams. The ideal candidate has a Bachelor’s degree in relevant engineering fields and at least 3 years of hands-on experience. Familiarity with SPC and advanced packaging is essential, making this an exciting opportunity to contribute to next-generation technologies.
#J-18808-Ljbffr