Lead Advanced Packaging Engineer – 2.5D/3D Systems

INSPIRE RECRUITMENT CONSULTING PTE. LTD. seeks a qualified professional for a pivotal role in semiconductor packaging. The successful candidate will oversee integration and architecture of advanced packaging technologies, requiring a Bachelor’s degree in Electrical Engineering and 8–20 years of experience in the field.

Your responsibilities will include driving performance and reliability qualifications while ensuring seamless transition in assembly flows. Strong communication skills in Korean and English are necessary for global collaboration.