Intern - Assembly Equipment Engineer

Project Title

Improvement of NSOP (Non‑Stick On Pad) Alarm for WB Process Early Detection

Scope

• Define and standardize NSOP (Non‑Stick On Pad) failure criteria in the WB process
• Improve NSOP alarm logic for early detection before mass failure occurs
• Collaborate with EE and Manufacturing Engineers to align alarm thresholds with actual bonding behavior
• Execute UAT and pilot run on selected WB machines after alarm enhancement
• Collect NSOP event data for downtime, frequency, and failure trend analysis

Deliverables

• Clearly defined NSOP detection criteria for WB process
• Improved or new NSOP alarm with early warning capability
• Reduction in unscheduled downtime caused by delayed NSOP detection
• NSOP alarm data available for equipment and process improvement analysis

Stretch Goal

• Correlate NSOP alarms with bond parameters (US power, force, tim...