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IC Packaging Engineer

Mindgrove Technologies Pvt Ltd

Chennai, Tamil Nadu, India Full-time July 12, 2026
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Vacancy Description

Job Title: IC Packaging Engineer

 

Job Overview

We are seeking a highly skilled and motivated IC Packaging Engineer to join our Advanced Packaging and Hardware Development team. In this role, you will be responsible for the design, development, simulation, and qualification of next-generation semiconductor packaging technologies. You will bridge the gap between silicon design and physical manufacturing, ensuring our integrated circuits (ICs) meet rigorous performance, reliability, and cost standards.

Key Responsibilities

1. Package Design & Development

  • Lead the conceptualization, architecture, and detailed design of semiconductor packages (e.g., BGA, QFN/QFP, WLCSP, SiP, 2.5...

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