Hybrid Senior Silicon Packaging Design Engineer

Intel Corporation in Penang is seeking a Silicon Packaging Design Engineer to lead the development of substrate designs. This role involves optimizing silicon-package-board interfaces and contributes to critical advancements in semiconductor technology.

The ideal candidate holds a Bachelor's degree in a relevant field and has at least 4 years of relevant experience. Proficiency in Cadence APD or Mentor Xpedition is essential. Join Intel to take the next step in your engineering career in a hybrid work environment.