HIG HBM - PE Design Validation Engineering Intern

As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology, you will develop next‑generation HBM products. Product Engineers act as the key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. Your ownership will span from the design phase, through initial bring‑up and qualification, to volume production.

In HBM HIG (High Bandwidth Memory, Heterogeneous Integration Group) you will integrate end‑to‑end front‑end and back‑end processes, debug tests, and implement qualification techniques to deliver low‑power, high‑density solutions for ML and AI workloads. HBM stacks multiple DRAM chips with a logic chip in a single package using TSV (Through Silicon Via) to increase memory density and enable high‑speed signal transmission. Verification and testing of HBM is complex, requiring custom gate‑level design and RTL logic design.