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Engr Prin, Package Development (NPI Mold Engineer)

onsemi

seremban, negeri sembilan, Malaysia Full-time June 08, 2026
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Vacancy Description

Job Summary

Discrete and Power module assembly process (End of Line: Mold, Trim/Form, CD/ED) Development. Key person responsible to align processes between R&D and Manufacturing. Establish process POR through setup, feasibility and characterization followed by package development procedure.

Responsibilities

  • End of Line process development and enabling technology for molded package.
  • Capable to understand the design and proposal for improvement from End of Line process.
  • Familiar with DFMEA, update DFMEA and generate PFMEA linked with DFMEA.
  • Familiar with EMC materials.
  • Capability to define KPIV from failures modes.
  • Capability to define KPOV and generate output by analyzing process capability.
  • Responsible for providing technical report from FMEA failures mode based on statistical analysis (JMP, Minitab).
  • Effectively working with technical leaders to generate process deliverables (Control Pla...

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