Director of Semiconductor Packaging & HVM Excellence

Renesas Electronics seeks an experienced Director of Semiconductor IC Packaging Assembly Engineering to lead sustaining engineering and high‑volume manufacturing for advanced packaging, including Smart Power Stages, wide‑bandgap packaging (SiC/GaN), and related interconnects. You will partner with OSATs and internal teams to ensure smooth NPI‑to‑HVM ramp and production readiness.

The ideal leader combines deep packaging expertise with data‑driven decision making, cross‑functional collaboration,