Die Bond Product Eng Manager | Lead Next-Gen Packaging

ITEC in Kuala Lumpur is seeking a Die Bond Product Engineering Manager to lead cutting-edge die attach technology for high-performance solutions. You will oversee product performance applications across key segments, ensuring competitiveness in reliability and cost-effectiveness.

Ideal candidates have over 10 years in semiconductor manufacturing and proven leadership in product engineering. Fluency in Mandarin and/or Cantonese is a plus. Join us to make a significant impact in the technology field.