Die Attach Process Engineer – Semiconductor Packaging

Nexperia in Malaysia is seeking a DACA Engineer (Die Attach Process Engineer) to develop, optimize, and sustain die attach manufacturing processes, driving high product quality and production efficiency.

The role collaborates with cross-functional teams to resolve technical issues, support new product introductions, and ensure stable production performance. Candidates typically have 5–8 years in semiconductor assembly, with Die Attach/DACA experience preferred.