Thermal-Mechanical Analysis Intern – Advanced Packaging

Advanced Micro Devices is looking for an intern for the Mechanical and Thermal Analysis of Advanced Packaged Devices. The internship is based in Singapore and offers a unique opportunity to gain hands-on experience with mechanical and thermal analysis techniques while collaborating with engineering teams on real-world projects. Ideal candidates are pursuing a Master's or PhD in Materials Science, Mechanical Engineering, or a related field. Strong analytical skills and proficiency in tools like MATLAB and Python are essential, along with excellent communication skills.
#J-18808-Ljbffr