Vacancy Description
Responsibilities
- Responsible for working with Broadcom's IC substrate subcontractors to manage and resolve issues relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices.
- Responsible for NPI activity, risk assessments, process improvement & development and production engineering support of high volume IC substrate manufacturing.
- Work with Broadcom internal cross functional engineering teams to resolve issues with interactive nature; work on newly developed packaging technology and drive towards high volume manufacturing maturity.
- Responsible for new product pre‑production engineering activity and drive improvements in process and visual mechanical yields, cycle time.
- Take on site‑to‑site standardizations in Best Known Methods, and verify compliance with Broadcom requirements.
- Drive capability enhancement and cost reduction projects.
- ...
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