Staff Packaging Engineer: Thermal Design & CFD Innovation

Sandisk in Penang is seeking a Packaging Engineer to join their Packaging R&D group. The role involves thermal modeling and validation of flash products in a compact design environment. Candidates should have a B.S. in Mechanical Engineering and 5 years of relevant experience, along with proficiency in CAD software like SolidWorks.

This is a unique opportunity to contribute to innovative product designs in a company that values diversity and inclusion.