Senior R&D Engineer, Advanced Packaging & IC Integration

Broadcom Inc. in Singapore is seeking an experienced engineering professional to lead IC packaging activities for advanced silicon products. Candidates should have a strong background in signal integrity, project management, and advanced packaging technologies

The ideal candidate will possess a BS/MS/PhD and 8+ years of industry experience. This role emphasizes collaboration with design teams and understanding of advanced materials and processes.

Broadcom is an equal opportunity employer committed to diversity and inclusion in the workplace.