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Senior Process Engineer

Renesas Electronics

Bayan Lepas, Penang, Malaysia Full-time June 03, 2026
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Vacancy Description


Job Description

We are seeking a Process Engineer with a minimum of 2 years of hands-on experience in semiconductor back-end assembly processes, particularly die bonding and wire bonding. The successful candidate will be responsible for process setup, optimization, yield improvement, and troubleshooting to ensure stable and high-quality manufacturing performance.

The role requires strong technical understanding of back-end equipment, materials, and process interactions, as well as the ability to analyze data, drive continuous improvement, and support production operations.

Key Responsibilities

  • Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements
  • Perform process troubleshooting and root cause analysis for yield loss, defects, and equipment issues
  • Support new product introduction (NPI), process qualification, and transfer to mass production
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