Vacancy Description
Internship opportunity in Process Engineering focusing on Die attach and Wire bond processes at Renesas, a leading embedded semiconductor solutions provider.
Your Role
Key responsibilities include:
- Learning process fundamentals for Die attach and Wire bond processes
- Applying data analysis techniques such as Statistical Process Control to identify product issues and propose improvement projects
- Collaborating closely with engineers to understand the entire workflow from Front of Line to End of Line
About You
The company is looking for:
- Bachelor’s degree in Material, Mechanical, Manufacturing Engineering, or a related discipline
- Exposure to programming languages such as C, C++, or Python through coursework or projects
Career Progression
- Opportunities to launch and advance your career in technical and business roles across four Product Groups and vario...
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