Vacancy Description
**Basic Purpose of the Job**
•Lead and develop the FOL Process Engineering organization (Die Attach, Clip Attach, Wire Bond, Plasma and AOI).
•Ensure stable yield, high equipment/process capability, adherence to customer and reliability requirements, and timely closure of quality/EFAR/GMRB issues.
•Drive continuous improvement, standardization, process governance, and readiness for volume and package‑mix expansion.
**Reporting Relationship**
•Reports to the Assembly Engineering Manager; leads a team of Process Engineers across Die Attach, Clip Attach, Wire Bond, Plasma and AOI.
**onsemi** (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovati...
•Lead and develop the FOL Process Engineering organization (Die Attach, Clip Attach, Wire Bond, Plasma and AOI).
•Ensure stable yield, high equipment/process capability, adherence to customer and reliability requirements, and timely closure of quality/EFAR/GMRB issues.
•Drive continuous improvement, standardization, process governance, and readiness for volume and package‑mix expansion.
**Reporting Relationship**
•Reports to the Assembly Engineering Manager; leads a team of Process Engineers across Die Attach, Clip Attach, Wire Bond, Plasma and AOI.
**onsemi** (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovati...
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