Process Engineer Intern: Die Attach & Wire Bond

A leading embedded semiconductor solutions provider is offering an internship opportunity in Process Engineering in Malaysia, Penang. You will learn about Die attach and Wire bond processes, apply data analysis techniques for product improvement, and collaborate with engineers. Ideal candidates have a Bachelor's degree in Material, Mechanical, or Manufacturing Engineering and exposure to programming languages like C, C++, or Python. This role offers a pathway to advance your career in technical and business roles.
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