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Package Design Engineer - 3D CAD (Inventor) for Lead Frame

Infineon Technologies

malacca city, malacca, Malaysia Full-time June 18, 2026
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Vacancy Description

A leading semiconductor company in Malacca City is seeking a design engineer to create specifications and designs for packages and lead frames. The ideal candidate will hold a Bachelor's degree in Engineering and possess skills in AutoCAD and Inventor. Responsibilities include using CAD tools to develop 2D and 3D models, liaising with engineers, and ensuring design specifications are met. Fresh graduates with relevant skills are encouraged to apply. This role offers an opportunity to contribute to innovative semiconductor technology.
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