Module Packaging Engineer: Thermal & Reliability Expert

Intel is seeking an experienced professional in Kulim, Malaysia, focused on developing assembly processes for semiconductor packaging. The ideal candidate possesses a MSc/PhD in a relevant engineering field, with at least 3 years of experience. Key responsibilities include optimizing manufacturing efficiency and ensuring quality standards throughout the packaging process.

This role requires regular onsite presence and offers a valuable opportunity to contribute to Intel's innovative roadmap in semiconductor technologies.