Vacancy Description
General Overview
Functional Area: Engineering
Career Stream: Design Engineering Hardware
SAP Short Name: LEN-ENG-DHW
Job Level: Level 08
IC/MGR: Individual Contributor
Direct/Indirect Indicator: Indirect
Detailed Description
- Advanced PCB Design & Layout: Execute advanced layout for complex, high-density, and high-speed multi-layer boards (including HDI, blind/buried vias, and microvias).
- Perform rigorous constraint management for critical high-speed interfaces such as DDRx, PCIe, LVDS, etc.
- Optimize component placement for signal integrity (SI), power integrity (PI), thermal performance, and EMI/EMC control.
- Develop high-quality designs for various board types, including rigid, flex, and rigid-flex configurations.
- Closely collaborating with electrical and mechanical teams to interpret requirements, resolve design issues,...
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