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Intern - SSD Process Engineer

Micron Technology

seberang perai, penang, Malaysia Full-time May 30, 2026
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Vacancy Description

Project Title

Selective Solder Tooling Enhancement and BOL Conversion Readiness Enhancement

Description

Enhance selective solder process robustness by introducing tooling improvements while strengthening BOL conversion readiness by introducing a standardized tooling selection system covering Cornerfill (CF), Selective Solder (SS) and Enclosure Assembly (EA). The project aims to reduce conversion ambiguity, setup errors and process variability across BOL operations.

Scope

  • Selective Solder Tooling Enhancement (SS)
  • Qualify and release selective solder process enhancement toolings to improve setup stability, consistency and repeatability
  • Address tooling‑related contributors to process variation during selective solder operations
  • BOL Conversion Readiness Enhancement (CF, SS, EA)
  • Develop and implement a tooling selection system defining required toolings for each product conversion across BOL

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