Intern, Assembly Equipment Engineer — WB NSOP Alarm Enhancement

Micron Technology, Inc in Penang, Malaysia, is seeking an engineer to enhance NSOP (Non-Stick On Pad) alarm capabilities for early detection in the Wire Bond process. The role involves defining failure criteria and improving alarm logic to prevent production downtime.

Candidates should have a background in Electrical, Manufacturing, or Mechatronics Engineering. The position offers opportunities to collaborate with various engineering teams and make significant contributions to process improvements.