Vacancy Description
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Project Title
Improvement of NSOP (Non‑Stick On Pad) Alarm for WB Process Early Detection
Description
Enhance NSOP (Non‑Stick On Pad) detection and alarm capability in the Wire Bond (WB) process to enable early identification of bond stick failure, reduce unscheduled downtime, and prevent extended production impact due to delayed NSOP response.
Scope
- Define and standardize NSOP (Non‑Stick On Pad) failure criteria in WB process
- Improve NSOP alarm logic for early detection before mass failure occurs
- Collaborate with EE and Manufacturing Engineers to align alarm thresholds with actual bonding behavior
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