Flip Chip Process Intern — Data-Driven Yield & AI

Micron Technology in Singapore is looking for an intern to join their Assembly Process Engineering team, focusing on semiconductor packaging processes, particularly Flip Chip Attach and Underfill technologies. Ideal candidates will apply statistical methods and AI programming techniques to enhance process development and yield improvement. Interns should have a degree in Mechanical, Chemical, or Material Science Engineering and be available from January to May 2026. This internship offers practical experience while contributing to real engineering projects.
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