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Engineer, Senior (Technology Integration - Wafer-level Packaging)

Qualcomm

singapore, singapore, Singapore Full-time June 03, 2026
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Vacancy Description

Company

RF360 Singapore Pte., Ltd.

Job Area

Engineering Group, Engineering Group > Hardware Engineering

Overview

General Summary: Job Scope

  • Responsible for end‑to‑end development, qualification, and mass‑production transfer of new processes, materials, and manufacturing technologies.
  • Ensure process readiness, robust manufacturability, and smooth ramp‑up through strong cross‑functional coordination, data‑driven decision‑making, and technology leadership.
  • Initiate and participate actively in discussions on formulation of process technology innovation and release process improvement.
  • Collaborate and develop effective working relationships with technology partners to accomplish project/ task goals within committed schedule.
  • Develop new and impactful ideas, materials, solutions, and/ or procedures for product fabrication process and technology meeting the business goals and launch schedule with competitive...

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