Die Bond Process Engineer - NPI & Yield Improvement

Renesas Electronics Corporation is seeking an Assembly Process Engineer to support production operations by optimizing manufacturing processes and leading New Product Introductions (NPI). The ideal candidate will have a Bachelor's Degree in Engineering, at least 2 years of relevant experience, and strong analytical skills. Responsibilities include troubleshooting, maintaining process documentation, and driving continuous improvement initiatives. This position is located in Selangor, Malaysia, and offers opportunities for professional growth in a dynamic environment.
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