Coating Process Engineer (Semicon/Substrate/PCB)

Adecco is partnering with a premier supplier of high-quality Flip Chip Ball Grid Array (FC-BGA) substrates in search of a Coating Process Engineer to join their organization.

• Develop and optimize coating processes for photoresist, and dielectric materials (e.g., PID, PI) on package substrates.
• Establish uniform coating parameters to ensure consistent layer thickness and adhesion.
• Optimize oven/thermal curing profiles for soft bake, hard bake, pre-bake, post-exposure bake (PEB), or final curing.

• Define tool requirements and support installation and qualification of coaters, hot plates, and curing ovens.
• Maintain and troubleshoot coating and baking equipment to ensure uptime and performance.
• Work with equipment vendors and facilities teams on preventive ma...