CMP Process Engineer: Advanced Packaging Focus

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Adecco is partnering with a premier supplier of high-quality Flip Chip Ball Grid Array (FC-BGA) substrates in search of CMP Process Engineer to join their organization.

The Job:

Process Development & Optimization

• Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric, etc.) in advanced substrate manufacturing.
• Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness.

Equipment & Tooling Support

• Define equipment specifications and validate CMP tools.
• Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies.

Yield & Quality Improvement

• Investigate and resolve CMP-relat...